Ultra-precision grinding technology is the processing of large-size wafers main method

At present, the fixed abrasive grinding technology of ultra-precision machining of large-size wafers is the main method, but the traditional diamond grinding technology will  polycrystalline diamond  to the wafer surface and sub-surface damage, thereby affecting the chemical mechanical polishing after the Road (CMP) process of machining time. The existence of CMP  synthetic diamond  efficiency is low, alkaline / acid slurry handling difficult issues. For monocrystalline silicon wafer grinding problems, this paper analyzes in depth the soft abrasive chemical mechanical grinding (CMG) silicon technology, based on the effects of different oxides soft abrasive grinding performance.