Developed including face polishing wheel, thin cutting blade

Semiconductor materials processing urgent need for new developments in the field of processing technology and abrasive grinding abrasive applications. Light-cured resin is a new material, which caused by light irradiation polymerization and curing, low energy consumption, while in high-clean non-polluting, therefore, in many fields has been widely used.  Diamond blade  years of research, for the first time successfully developed including face polishing wheel, thin cutting blade  grinding wheel a variety of light-cured resin binder based on a new type of abrasive. In this paper, light-cured resin blade for the study, by studying the light-cured resin as a binder abrasive combination of theory, to find ways to improve the performance of abrasive combination.