Change the wafer planarization processing technical problems faced by many outstanding

IC chip in order to increase production, reduce unit manufacturing costs tend large wafer diameter. As wafer diameter increases, in order to ensure sufficient strength of silicon, a corresponding increase in the thickness of the wafer; the contrary, in order to  cubic boron nitride  of advanced IC chip packaging technology, thinner thickness of the chip. These changes make the wafer planarization process faces many outstanding technical issues: IC feature size decreases, for wafer  cutting tools  and surface quality high demands; wafer diameter increases, the process is easy to warpage, machined surface type easy to ensure accuracy; silicon thickness  abrasive grinding and chip thickness decreases, so that the back of wafer thinning process increases the amount of material removal, improve processing efficiency become a serious problem.