Grinding technology to become the light back thinned silicon wafer and the mainstream graphics processing technology

The new ultra-high-precision wafer planarization process has been a lot of research, which, using fixed abrasive silicon ultra-precision grinding technology is gradually replacing the traditional grinding technology to become light and graphics back of the silicon wafer thinning mainstream processing technology. However, the current silicon ultra-precision grinding wheel is generally used in micronized  Polycrystalline diamond  wheel, diamond  Synthetic diamond , the wafer surface will inevitably produce grinding damage, but also the need for further chemical mechanical polishing. Therefore, it is necessary to study and explore new principles using the new wheel silicon processing methods to obtain super smooth surface grinding low damage. This paper proposes the use of soft abrasive grinding wafers low damage new method;