By chamfering the edges of the cut wafers processed through the formation of an arc-shaped grinding wheel

Chamfering in silicon wafer processing plays an important role , it is a semiconductor material processing before the procedure , the main purpose is to improve the wafer edge quality , it will cut through the chamfered edge of the wafer after  synthetic diamond  to form a circular shape. Wafer chamfering machine for its high technical content , a huge market , with good development prospects. However, due to the machine control system complexity , action and more, data volume, high precision requirements of each action are independent, but the timing and inter-related , DMC motion control card in the software and hardware aspects have a strong feature,  grinding wheel  design, using this card , combined with the VB development environment to achieve a wafer chamfering machine control requirements , and have achieved good results. Chamfering machine motion control card system and implementation of this device in the development process , using a digital motion controller series of two independent board controller, motion control card features a motion control card intelligent motion control card , the internal 32-bit high-speed MCU ( micro-program controller unit ) can be controlled axes , while providing the servo and stepper motor interface, the user can be used in any combination , to achieve optimum control system configuration.