Free abrasive wire saw cutting technology

With the increasingly widespread application of hard and brittle material, its processing requirements are also increasing, especially for monocrystalline silicon, gemstones and other precious precision cutting hard and brittle materials have become increasingly demanding. However, China's high-precision cutting hard and brittle materials is still in the development stage, the processing cutting tools is low, the material waste. Currently, hard and brittle materials such as silicon crystal used mainly free abrasive cutting wire sawing techniques, namely the cutting edge to edge with an abrasive slurry delivery wire (diamond or silicon carbide slurry). However, the free abrasive wire sawing technique has significant disadvantages: low cutting efficiency, kerf loss, surface roughness and face precision is difficult to control, difficult recovery slurry, grinding wheel, etc. To solve these problems, fixed abrasive wire the study saw more and more attention from researchers, especially electroplated diamond wire saw wire saw and a resin binder of research, but resin bond wire saws wear resistance and heat resistance than Polycrystalline diamond wire saw good. Diamond wire saw is the high hardness, high wear resistance of the diamond abrasive grains by electroless plating on the steel wire based firmly grip body made ​​of a cutting tool. In addition, electroplated diamond wire saw with high cutting efficiency, cutting force is small, tidy kerf, cut finishing, the material is high, low noise, environmental pollution, etc., not only for processing stone, glass and other brittle ordinary materials, and particularly suitable for cutting ceramic, precious stones, crystals and other precious hard and brittle materials, this paper studied using the composite plating electroplated diamond wire saw manufacturing process, and gives the manufacturing electroplated diamond wire saw optimum parameters.