Trimming mechanism perspective, the existing common breakage, flatness, etc.

Effective shaping and sharpening a research in this field is important semiconductor and ceramic materials are typically brittle material point. Many scholars around the world are doing in this regard so that the processing time of their brittle and prone to cracking broken, the same study, and therefore produce a very wide range of diamond grinding wheel when the performance of the semiconductor and ceramic parts for surface roughness, trimming method . Trimming mechanism from the perspective of the existing common breakage, flatness and other parameters  cutting tools , so the current method of diamond grinding wheel dressing. Divided into three categories, namely until the consolidation of semiconductors and ceramics parts precision finishing _ two methods are still abrasive dressing, free abrasive  synthetic diamond and special processing method. For the grinding and polishing methods. This processing method is weak evaluate a critical indicator of the merits of dressing method has two aspects, the point is the low productivity, high production costs. First, scholars from various countries in  abrasive grinding , shaping the efficiency and accuracy, the second is the quality of dressing. Existing studies have shown that, if the diamond powder in a diamond grinding wheel dressing method, either conventional mechanical grinding depths smaller side of the semiconductor ceramic materials and ultra-law or special processing methods, this and that there are precision grinding.