All diamond surface metallization

If all of the diamond surface metallization, diamond particle surface has good electrical conductivity, and not prepared for electroplating diamond tools. Buried in the sand in the process of diamond plating the steel substrate and the coating together  polycrystalline diamond  the cathode, there will be a large number of diamond particles are bonded together to form a block of the phenomenon. Thus  abrasive grinding  used surface conductive particles dispersed diamond production electroplated diamond tool. Method is to control the extent of the surface of  Diamond blade , strictly control the sensitizing solution and the concentration and activation of sensitization and activation time of the metal on the surface of the diamond keep the number of particles within an appropriate range. Although the number of diamond particles on the surface of the conductive increase, increase and the connection point between the metal coating to improve the binding properties of the diamond coating. But when the metal particle is too dense, it will form a connection into a piece of thin metal layer.